Server liquid cooling module

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PRODUCTS Coolinside full-chain liquid cooling solution Server liquid cooling module
Server liquid cooling module
Server liquid cooling module
PRODUCT PROFILE
PRODUCT FEATURES
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Overview
Server liquid cooling module

Efficient heat dissipation is achieved through the indirect contact between the coolant and the chip. Compared with the traditional air cooling solution, the liquid cooling solution can significantly reduce the PUE in data centers, as well as noise, dust, vibration, etc.

CPU cold plate: Corresponding cold plate products have been developed for the current mainstream CPU platforms to meet customized needs of our clients to the greatest extent.

GPU cold plate: Corresponding cold plate solutions have been designed according to the heat dissipation requirements of the GPU (PCIe/SXM).

Features
Professional simulation
Ability to provide customers with simulation reports on thermal performance, flow resistance, flow rate and structural strength during the design phase
High efficiency with low resistance
Ability to cool the heat source with a heat flux density as high as 100 W/cm2 and achieve a pressure drop of the whole cold plate less than 30 kPa
Safe and reliable
Rigorous testing and verification to prevent coolant leakage and flow channel blockage during long-term operation
PARAMETERS
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References
Coolinside Full-chain Liquid Cooling Solution
Coolinside Full-chain Liquid Cooling Solution
Based on the features of servers including high heat density, high energy consumption, and security compatibility, we have conducted in-depth R&D and design. Featuring full chain independence, our solution integrates design, manufacture, delivery, and after-sales to achieve full life cycle services.
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